Total 25 job vacancies by Stats Chippac Pte. Ltd.

Key Job Accountabilities (Actual daily deliverables):

The Buyer shall perform the following purchasing tasks for direct and indirect material:-

- Analyze system-generated MRP and convert the requirement to Purchase Orders.

- Determine the latest pricing and supplier allocations to generate the Purchase Orders for approvals, ensuring timely deliveries and inventories are maintained at desired levels.

- Manage in-house inventory according to policy.

- Optimize inventory through consignment program.

- Identify purchasing risks and flag concerns. Follow up on problematic materials until they are received and acceptable for use.

- Handle material disposition and RMA# for return of rejected material to supplier.

- Request and analyze quotes and competitive bids

- Negotiate purchase terms and conditions, eg, quality standard, price, delivery lead time, etc.

- Alternate sourcing and review value engineering for cost reduction opportunities

- Perform supplier scoring quarterly. Ensure compliance of company standards, procurement policies and procedures

- Drive continuous improvement such as quality improvement, cost reduction, lead-time reduction, payment terms improvements etc

- Able to work independently with people at all levels in a fast-paced environment

- Undertake ad-hoc duties and responsibilities as assigned

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Diploma or Degree holder, preferably in Engineering or Business Administration.

• Minimum 3 years’ working experience in purchasing, preferably in semiconductor or electronics industries.

• Strong communication and negotiation skills.

• SAP knowledge

Job Description & Requirements

Key Job Accountabilities (Actual daily deliverables):

· To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

· Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

· Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

· Ability to lead cross functional teams to drive improvement.

Key Job Accountabilities :

· Set-up wet etch and plating processes

· Write process specifications and operator instructions

· Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time

· To provide interim and long-term corrective actions for any discrepancies

· Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities

Required Experience and Qualifications :

· Requires Degree in Physics, Chemical, Material Science, Electrical/Electronics Engineering or equivalent

· Minimum 2 years of relevant experience in wafer bumping or wafer fabrication technology in wet etching chemistry, and/or Plating technology

· Ability to work on 12-hour rotating shifts or swing shift if required

Key Job Accountabilities (Actual daily deliverables):

• Co-ordinate / Execute new product offloads plan
• Interface with customer on product offloads and provide assessment and information on test capabilities and providing resolutions to barriers/constraints
• Performs required test correlation, evaluation, and test characterization on new product offloads, and shall communicate to customer the test results or if any- test correlation issues and resolutions
• Generate Test Setup Specification based on customer’s test requirements for production to support the product
• Evaluate and recommend process change/s for improvements to help improve yield, quality, and cycle time
• Provide required test support needs by Engineers
• Sustain test program, hardware and major setup issues in mass production

Required Qualifications:

• Diploma in Electronics / Electrical Engineering or its equivalent
• Minimum 2 years of experience, preferably experience in semiconductor or subcontracting industry
• Fresh graduates are welcome to apply

Job Description & Requirements

Key Job Accountabilities (Actual daily deliverables):

· To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

· Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

· Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

· Ability to lead cross functional teams to drive improvement.

Key Job Accountabilities (Actual daily deliverables):

· Write process specifications and operator instructions

· Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.

· Support on new device, new material and new equipment qualification.

· To provide interim and long-term corrective actions for any discrepancies.

· To support photolithography process including yield improvement, SPC control, trouble shooting on stepper and track issues

Required Experience and Qualifications

· Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.

WE ARE EXPANDING AND LOOKING TO GROW OUR TALENTS!

Job Highlights

• Career Progression
• No Experience needed, Training provided
• Islandwide Transportation Provided

Job Description

Key Job Accountabilities (Actual daily deliverables):

• Perform set-up and conversion to support production
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts
• Determine methods and procedures independently and provide guidance to less experienced team members when required
• Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost

Required Qualifications:

• Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent
• 2 years of relevant experience in wafer bumping or wafer fabrication are preferred otherwise candidates without experience are welcomed to apply as training will be provided
• Ability to work on 12 hours rotating shift

*We regret to inform that only short-listed candidates will be notified.

Responsibilties

· Responsible for maintenance and repair on any of the following equipment such as Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

· Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.

· Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.

· Communicates with Manufacturing, Process, QA, Central Engineering (NPI), Pre-assy, to solve issues involving other group.

Requirements

· Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.

· Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.

· Diploma in Electrical/ Electronics/ Mechanical / Mechatronics, Chemical, Material, Science or its equivalent with 3 - 8 years experience in similar field.

· Hands on experience in handling Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

· Useful experience in Wafer Bumping, Back grind and Wafer Saw

Job Description & Requirements

Key Job Accountabilities (Actual daily deliverables):

· To attain the highest quality and productivity through work simplifications and standardization, implementation of best known methods and implement robust system solutions.

· Sustain and provide continuous process improvement through planning, evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of quantity, yield and cycle time.

· Liaise with customers & potential customers on development & improvement of process, material and equipment capabilities.

· Ability to lead cross functional teams to drive improvement.

Key Job Accountabilities:

• Lead and supervise a team of Line Leaders, Manufacturing Specialists and Material Handlers to meet day to day performance targets
• Monitor Promis Manufacturing Execution System (MES) to achieve day to day output and critical wafer move target
• Lead cycle time improvements using Manufacturing Dispatch System (MDS)
• Participate in manpower productivity and cross-functional team cost breakthrough projects
• Initiate/Participate and drive 200mm error-proofing activities for best-in-class cycle time, quality and yield
• Manage 200mm and production areas to ensure line discipline and good housekeeping
• Guide the team in compliance to quality related mandatory manufacturing practices
• Provide shiftly reporting and investigate quality related issues with 8D, OPL, DRB and MRB reports
• Provide periodic certification training and guidance to shift manufacturing team
• Work closely with process and equipment engineering teams on day to day line issues
• Work with Production Planners to meet on time delivery and customer requirements
• Ensure excursion-free production ramp.

Required Experience and Qualifications:

• Recognised Degree in any discipline
• Minimum two years of manufacturing engineering experience in wafer fabrication or wafer-level packaging.
• Able to work 12 hours permanent night shift or rotating shift.\Adapt to a fast paced and dynamic cleanroom work environment.
• Proactive and able to highlight potential issues
• Good leadership, communication and interpersonal skills.
• Detail-oriented, good initiative and team player.

Key Job Accountabilities (Actual daily deliverables):

· Write process specifications and operator instructions

· Sustain and provide continuous process improvement through evaluating, verifying and executing procedures to ensure that products meet all customers’ requirements in terms of cost, yield and cycle time.

· Support on new device, new material and new equipment qualification.

· To provide interim and long-term corrective actions for any discrepancies.

· To support photolithography process including yield improvement, SPC control, trouble shooting on stepper and track issues

Required Experience and Qualifications

· Requires Degree in Electrical, Electronics, Mechanical, Materials Engineering, Physics, or Chemistry.

Responsibilties

· Responsible for maintenance and repair on any of the following equipment such as Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

· Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.

· Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.

· Communicates with Manufacturing, Process, QA, Central Engineering (NPI), Pre-assy, to solve issues involving other group.

Requirements

· Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.

· Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.

· Diploma in Electrical/ Electronics/ Mechanical / Mechatronics, Chemical, Material, Science or its equivalent with 3 - 8 years experience in similar field.

· Hands on experience in handling Laser Mark, UV-cure, AOI, TnR, Vision Systems, Inspection Station and Packing station.

· Useful experience in Wafer Bumping, Back grind and Wafer Saw

WE ARE EXPANDING AND LOOKING TO GROW OUR TALENTS!

Job Highlights

• Career Progression
• No Experience needed, Training provided
• Islandwide Transportation Provided

Key Job Accountabilities:

• Responsible for the daily production activities such as wafer / finished product handling and operating a variety of equipment.
• Perform basic machine setup / Conversions / Recipe change. Perform basic machine setup / Conversions / Recipe change / handle machines assists / perform minor repair
• Must maintain a good record on the documentation, like, production traveller, log sheet, specifications, etc.
• Must be able to meet production goals.
• Maintain good housekeeping standards in the production area and ensure good safety practices are maintained Identify potential work.
• Follow strict compliance to Standards Operating Procedures (SOP).

Required Experience and Qualifications:

• ITE Nitec & Above or experience operator
• Experience in the Semiconductor / Manufacturing industry preferred. On the job training will be provided.
• Able to perform a 12-hour rotating / permanent shift.
• Able to work in a cleanroom and yellow light environment.
• Candidate must be comfortable to wear Jumpsuit (PPE Attire).
• Ability to understand written and spoken English.

Key Job Accountabilities:

• Perform failure analysis on integrated circuit (IC) package chips to identify root causes of failures
• Perform reliability tests for customer qualifications, new package development qualifications, process / material qualifications and in-house evaluations
• Participate in internal and customer meetings, issue resolution, and audits technically and effectively
• Maintain all FA & Rel equipment in laboratory and ensure functionality at all times
• Supervise a team of Associate Engineers or Technicians
• Update FA methods
• Train new staff in usage and familiarization of equipment in FA & Rel Lab

Requirements:

• Minimum Degree in Electronic and/or Electrical Engineering or any related field
• At least 2 years’ related experience in IC packaging environment
• Good working knowledge and experience in IC failure analysis techniques
• Preferably familiar with industrial reliability test standards such as Mil-Std 883 and JEDEC standards
• Some knowledge of Wafer process or Wafer BE process is an advantage

Key Job Accountabilities (Actual daily deliverables):

• Manage maintenance and operation of CCTV system, Access Control System (ACS), break glass sensor and turnstile
• Manage and respond for emergency response plan for various alarm and drills
• Manage access control badge
• Manage car park system
• Manage Security operation, documents and inventories
• Manage PA system and exit light
• Manage security system and EHS related trainings
• Manage committees EHSS and 6S
• Maintain standards (ISO, TAPA, RBA & etc) requirements
• Manage chemical program and SDS
• Manage work permit system and carry out any other duties as assigned
• Familiar to EHSS management system

Required Experience and Qualifications:

• Minimum Diploma
• Candidates with no EHSS experience can be considered.