Total 3,110 Education / Training job vacancies in D19 Serangoon Garden, Hougang, Sengkang, Punggol

The National Quantum Federated Foundry (NQFF), hosted at the Institute of Materials Research and Engineering (IMRE), part of the Agency for Science, Technology, and Research (A*STAR), is looking for a research scientist who is experienced in RF electronics simulations and design. The successful candidate will be part of a team of research scientists and engineers working on devices and hardware for quantum technologies, including superconducting qubits, resonator systems, opto-electronic and photonics devices, control systems, and so on. The work in NQFF will support local and international efforts to develop and translate quantum technologies to realize exciting real-world applications.

The roles of the successful candidate will include:

• Design and simulation of electrical and opto-electronic devices for quantum technologies
• Assist the formulation of device fabrication and testing plans
• Operation and maintenance of simulation software and workstations
• Analysis and presentation of scientific results

Job requirements:

• PhD degree in physics, applied physics, electrical engineering, material science & engineering, or any other relevant disciplines.
• At least more than 10 years of relevant experience
• Experience in RF hardware/electronics simulations and design
• Familiarity with superconducting qubit design and cryogenic devices is highly desired
• Expertise in simulation software (COMSOL, HFSS, etc) and scripting/programming
• Ability to independently plan and execute research work
• Ability to communicate well and work closely with team members

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Requirements

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- Candidate must possess a Certificate or Diploma in Early Childhood Education.

- Candidate must be able to write and deliver lesson plans in English.

- Candidate must be an English L2 Teacher qualified by ECDA.

Job Description

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- Carry out routine care for young children

- Deliver lesson plans to help children learn and develop their potential

- Set up inviting and enriching classroom environment

- Plan and deliver meaningful and engaging activities for children

- Engage stakeholders, such as parents and communities to help children learn better

- Provide periodic updates to parents on the children's learning and development

- Plan and organise activities and events such as field trips and concert

- Work with colleagues and Principal to obtain Centre License, SPARK, Healthy Eating for Preschool, etc.

Dance Instructor Job Description

We are looking to hire a passionate Carnatic Vocal and Keyboard instructor to join our traditional school. You will be responsible for teaching and training a dynamic group of students the various ragas (melodic scales) and talas (rhythmic patterns), and also instilling a deep understanding and appreciation for the art form.

Responsibilities:

• Ability to teach Carnatic music from beginner to advanced level.
• Develop curriculums and prepare lesson plans based on the School Syllabus.
• Ability to communicate with a diverse group of teachers and students.
• Engage, encourage, and motivate students to reach their goals.
• Evaluate student performance and make recommendations for improvement.
• Provide fun and creative environment.

Requirements:

• Proven experience in the area of vocal music training.
• Bachelor's Degree in Music and qualification from an accredited college.
• Good communication skills.
• Energetic, driven, creative and dependable.
• Demonstrate patience and leadership skills.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Role & Responsibilities:

• Responsibilities include diagnosing appropriate levels of metal/metal-alloy contaminations by oxygen and other contaminants; determining the root cause of contaminants, and establishing protocols for characterizations.
• Hands-on providing support for onsite metal PVD, including creating, running, and characterizing recipes to achieve the lowest resistances.
• Collaborates closely with equipment vendors and device engineers to optimize the metal-stack for device performances and robustness/reliability, from low to high temperatures.
• Lead data analysis related to implant-induced defects and cleaning issues on metal contacts with solutions development.
• Examines the work-functions of metal/metal-alloys suitable for Ohmic contact on SiC.
• Responsible for designing experiments for Ohmic contact on various SiC substrates with different doping types, determining their impact, and resolving issues to achieve the lowest specific contact resistances.
• Designing cleaning processes to obtain ideal Schottky diode using various metal/metal-alloys on SiC for high-performance applications.
• Work closely with cross-departmental and integration teams and in 3-5 years’ time develop a WBG backend process integration team of at least 4 persons.

Requirements:

• PhD Degree in Material Science, Physics, Electrical Engineering or related field.
• >8 years related industrial experience inclusing backend process module integration.
• Extensive hands-on experience in PVD (Physical Vapor Deposition) processing for metal depositions and interface tuning.
• Strong understanding of metal-semiconductor contact physics.
• Expertise in work-function tunings of metal and metal-alloy.
• Proficiency in modulating electron affinity through implantation or surface treatments of semiconductors.
• Familiarity with wide band-gap semiconductor materials and their interaction with metal/metal-alloys at various temperatures.
• Thorough fundamentals in Ohmic contact and Schottky diode physics, as well as the impact of defects and contaminations on electrical properties.
• Skilled at mentoring and transferring knowledge to junior staff members.
• Excellent communication skills to effectively address customers' needs, concerns, and solution requirements.

Job Description:

Be part of an exciting Team working on cutting-edge advanced packaging process technologies. Partner and work with various FAB users, to always enable smooth operations and develop packaging solutions and taking the solutions from concept to production. Responsibilities will also include assisting in operations support in FAB clean rooms to make sure all rounded supports are provided.

This position is based in Singapore.

Responsibilities:

• Looking for a reliable, agile, and professional individual.
• Oversee the Team spare/ chemicals / inventories stores – upkeep with good house-keepings, periodic cycle counts. Maintain the inventory database, ensuring timely and accurate recordings, raise purchase requests accordingly.
• Take charge and provide day to day supports in all logistics needs and initiate material/spare parts procurement when required to ensure smooth Fab operations.
• Accountable for the inventory movements required to enable smooth lot operations across IME Premises.
• Follow through the orders from the start of purchase till delivery and to ensure that goods are delivered are on time.
• Work seamlessly with various stakeholders to provide logistics support and deliver inventory on time.
• Work towards and employ critical thinking, put-up good initiatives to move forward to digitalization.
• Ability to work in a multi-task environment.

Experience:

• Education: Diploma in engineering discipline. Preferably in supply chain logistic/ warehouse operations.
• At least 2 years of warehouse operations.
• Preferably some experience in semiconductor / manufacturing environment, with good wide contacts with semiconductor material suppliers, equipment vendors.
• Strong knowledge-based on excel skills and some knowledge of supply chain analytics.

Candidate will be required to develop, secure and manage industry partnerships for the NGTC. Candidate should stay updated on RF/mmWave GaN market trends and conduct thorough market research and competitive analysis on companies, competitors and the market for actionable insights. This may involve conducting SWOT analyses to enable NGTC to come up with a strategic plan to optimise business and research collaborations.

Candidate will also be responsible for developing and executing marketing strategies to promote NGTC’s capabilities to interested parties.

Candidate will be required to work alongside various internal and external stakeholders and teams to develop NGTC’s strong value propositions and assist with market intelligence to shape the NGTC’s strategies.

Candidate will be required to carry out account management of companies for NGTC to strengthen customer relationships.

Candidate will be required to coordinate and engage with internal stakeholders such as A*STAR’s Industry and Enterprise Group, Institute of Microelectronics or various other public sector agencies.

Requirements:

• Degree in Science or Engineering
• Minimum 5 years of relevant working experience, preferably with a background in GaN technology and industrial commercialization.
• Able to structure and negotiate collaboration agreements.
• Strong analytical skills.
• Strong communication (written and verbal), marketing and interpersonal skills.
• Results oriented, pro-active, and a team player.
• Adaptable and comfortable working in a fast-paced and fast-changing environment.
• Passion to develop Singapore’s semiconductor ecosystem.

As an Equipment Engineer, you will own all assigned toolsets. The preferred candidate can troubleshoot difficult and poorly defined problems related to mechanics, electronics, and processes using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will collaborate extensively with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Responsibilities:

• Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Main Stream Semiconductor Processes and Advanced Packaging processes. Highly desirable for a candidate to have a background in at least one of the following areas: Photolithography, PVD and CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology (some areas may be combined).
• Work with process engineering to drive root-cause corrective actions for equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
• Lead continuous improvement teams to drive tool matching, availability, and throughput improvements and reduce risk.
• Management of new tool installation, start-up, and tool upgrades to increase fab capability and capacity, lower costs, and improve yields.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
• Participate in cross-functional teams that create efficiencies across all layers of the organization.

Required Qualifications

• Degree / Diploma with 10+ years of relevant Semiconductor Industry Experience in Mechanical, Electrical, or Chemical Engineering, Materials Science, Physics, or another relevant Engineering discipline.
• 6+ years of experience within the respective areas of expertise. Experience should include one or more: Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, and Wet Chemistry.
• Demonstrated experience with the application of structured problem-solving methodology.
• Positive interpersonal skills, highly energetic and self-motivated.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.

Preferred Qualifications

• Diploma or Bachelor of Science/Engineering in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.
• Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, Wet Chemistry.
• Positive interpersonal skills, highly energetic and self-motivated.
• Experience with Automated Fault Detection and Classification Systems (FDC).
• Strong background with utilizing SPC.
• High level of understanding of equipment component behaviour.
• Experience Integrating Equipment Maintenance Management Software

Scientist/Senior scientist will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to:

• Design and simulation of superconducting circuits for salable quantum processor in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detector.
• Design and layout of circuits components of a superconducting qubit.
• Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on the simulation results.
  Prepare competitive grant research proposals and lead execution of these proposals.
  Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Job Requirements:

• Master/PhD in quantum computing; Electrical and Computer Engineering; Material science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processor. Deep understanding on 3D quantum package
• Working experience on measuring loss and dielectric constants of materials at cryogenic temperatures
• Strong communication, industry awareness, and problem-solving skills.
• Highly motivated to succeed, a self-starter who is driven and able to work with others effectively to get things done.

ROLE:

IME A*Star is currently working on establishing a hybrid fabrication platform for 150mm & 200mm Silicon Carbide (SiC) power MOSFETs as part of the new SiC R&D program. The main objective of this program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration for various types of power MOSFETs and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, with a specific focus on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this deputy lead for wide-bandgap device integration role include the development and integration of several modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, ohmic contact formation etc are essential. We are actively looking for individual with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, device layout design, design verification, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• To lead development of SiC power technologies, serving as both front and back-end process integration in collaboration with advanced module development team. And aim
to grow this team to ~10 headcounts in the next 3 years.

• Optimize and customize process flows for individual SiC products

• Identify and resolve process integration issues and related problems

• Develop specific or derivative processes to meet customer needs

• Support new designs by conducting module characterization and developing effective design rules

• Define and implement measures to enhance stability, yield, reliability, and reduce development costs & time

• Plan and implement sustainable corrective actions to address process deviations

• Continuously monitor and utilize expertise in process and equipment capabilities to achieve optimal device performance

• Determine the correct and effective way to deliver processes, functional devices, and other items to multiple customers

• Perform project management tasks and conduct data analysis

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device Physics

• Highly proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and MOSFET device physics

• Proficient in teaching and knowledge transfer to junior staff members

• Strong communication skills to effectively convey information about process module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data; combined with strong presentation abilities.

Job Summary:

• Industry: Healthcare
• Employment type: Part-time (20-22 hours/week), contract for 2 years
• Working location: Jurong West

Job Responsibilities:

• Collaborate and assist in designing and developing a new robust psychometric instrument, or validating an existing one, for measuring multimorbidity.
• Collaborate with study investigators to define key constructs and dimensions of multimorbidity.
• Develop survey items and scales that accurately capture the localised complexities of multimorbidity in a primary healthcare setting, adapting from existing measures and methodologies.
• Perform pilot testing and statistical analyses to evaluate the validity and reliability of the instrument(s).
• Present findings and recommendations to the study team
• Provide training and support to study team members on using the psychometric instrument(s).

Job Requirements:

• Master’s/PhD in social sciences, statistics, or a related field
• Proficient in statistical software (SPSS/R/STATA/NVivo)
• Knowledge of psychometric measurement theories (e.g. ITT/CTT) and research methodologies
• Expertise in quantitative and qualitative data analysis, including advanced statistical techniques.
• Ability to present complex data and findings.
• Experience in healthcare-related research projects is highly desirable.

By submitting any application or résumé to us, you will be deemed to have agreed and consented to us disclosing your personal information to prospective employers for their consideration.

We regret that only short-listed candidates will be notified.

Registration No: R24123448 / EA Licence No: 12C6253

ROLE:

A*Star-IME is currently working on establishing a hybrid fabrication platform for 150mm and 200mm Silicon Carbide (SiC) power MOSFETs as a new pillar on Singapore"s Future of Microlectronics in wide-bandgap. The main objective of this SiC RnD program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, specifically focusing on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this role to be successful include the development and integration of several process modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, and ohmic contact formation. We are actively looking for individuals with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• Lead develop process technology for SiC power MOSFETs and ensure it meets the requirements for prototyping manufacturing

• Collaborate with advanced process module development team to establish a process flow for fabricating specific MOS devices

• Responsible to develop and improve test structures that enable fast and rigorous characterization of process

• Accountable to improve device performance and yield through the design, execution, and analysis of experiments for each specific device and product

• Work with cross-functional teams to minimize defects and address technical and yield concerns

• Drive CIP (Continuous improvement plans) to deliver integrated process modules and specific device per project goals

• Make decisions regarding the delivery of process, active and passive devices to multiple customers

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device physics

• Proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and the physics of MOSFET devices

• Strong communication skills to effectively communicate information about module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data, coupled with strong presentation abilities

• Ensure well-being of children at the centre especially safety and hygiene
• Prepare and organise teaching activities according to lesson plans
• Create a safe and fun environment for the children to learn and play
• Maintain and liaise closely with parents on children's development
• Conduct observation and assessment on children's learning progress

Requirements:

• DECCE or its equivalent
• L2 Certificate from ECDA
• Basic computer skills

Benefits:

• Annual Leaves, Birthday Leave etc.
• Bonuses and Incentives
• Sponsorship for training and teaching qualification

We regret that only shortlisted candidates will be notified.

As part of IME Integrated Circuit Design and System Department, we are seeking a candidate with relevant experience in analog integrated circuit design. This candidate will have the opportunity to develop unconventional ultrasound transducer drivers, receiver circuits for IoT and biomedical applications as well as cutting-edge high-speed analog circuits for advanced optical communication.

Role & Responsibilities

• Design and tapeout circuit blocks e.g. high linearity low-noise amplifier, variable gain amplifier, envelop detector, and high voltage driver for MEMS ultrasound transducers.
• Work together with team on system integration and demonstration.
• Work together with team to investigate novel circuit/system solutions to create new inventions.

Requirements

• Master’s / PhD degree in Electrical Engineering or equivalent
• Minimum 2 years of transistor-level analog circuit design experience
• Good understanding of CMOS analog IC design methodologies and successful tapeout experience
• Familiar with analog IC design and verification flow
• Design experience with high voltage BCD process would be a plus
• Familiar with the IC test equipment such as oscilloscope, spectrum analyzer, etc.
• Able to generate high-quality scientific publications and patents
• Team player, quick learner and self-driven

Job Description:

• Develop epitaxial processes for selective and non-selective growth of Ge and SiGe layers on Si substrates.
• Improve baseline processes for high-quality SiGe and Ge epitaxy: control uniformity and thickness and minimize threading dislocation density.
• Design epitaxial structures and develop processes for Ge and SiGe photodetectors (PD) and electro-absorption modulators (EAM) devices, integrating Ge/SiGe devices into Silicon photonic circuits.
• Troubleshoot to maintain tool and process quality. Prepare Standard Operating Procedures (SOPs), Out-of-Control Plans, and other technical documentation to maintain processes and tools.
• Perform metrology and characterization of SiGe and Ge epilayers (e.g., dopant and thickness uniformity, surface roughness, crystal quality, stress, carrier lifetime, etc.).
• Correlate SiGe and Ge crystal defects (type and density) with device performance and yield, and with device processing conditions.
• Provide technical support for technology transfer and process release requirements.
• Prepare technical presentations and papers for meetings, conferences and journals.

Requirements:

• PhD degree in Materials Science and Engineering, Physics, Chemical Engineering, Chemistry, Microelectronics Engineering, or closely related fields are welcome to apply.
• Prior 3 to 5 years direct experience in SiGe/Ge epitaxy and materials characterization.
• Working knowledge and prior hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, and problem-solving methods, is desired.
• Understanding of epitaxial system hardware is advantageous.
• Knowledge and prior hands-on experience on basic process characterization techniques such as SEM/TEM, EDX, SIMS, AFM, Ellipsometry is advantageous.
• Possess good interpersonal and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.