Total 744 job vacancies by A*star Research Entities

Scientist/Senior scientist will be part of heterogeneous integration group focused on development of the quantum packaging technology platforms to integrate qubit and control chip on superconductivity interposer.

He/she will work with cross functional team to:

• Design and simulation of superconducting circuits for salable quantum processor in 3D flip-chip architecture.
• Explore and develop superconducting nanowire base photo detector.
• Design and layout of circuits components of a superconducting qubit.
• Develop design rules and PDK for quantum packaging technologies.
• Provide quantum packaging solutions to meet the system requirements based on the simulation results.
  Prepare competitive grant research proposals and lead execution of these proposals.
  Engage industry partners to align and develop the building blocks required for next generations quantum packaging platforms.

Job Requirements:

• Master/PhD in quantum computing; Electrical and Computer Engineering; Material science area
• 4 to 5 years’ experience in superconducting circuits design and simulation for scalable quantum processor. Deep understanding on 3D quantum package
• Working experience on measuring loss and dielectric constants of materials at cryogenic temperatures
• Strong communication, industry awareness, and problem-solving skills.
• Highly motivated to succeed, a self-starter who is driven and able to work with others effectively to get things done.

We are seeking a highly skilled High-Speed IO Modeling designer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (Masters/PhD) , with a focus on high speed circuit modeling, statistical analysis, jitter analysis, digital signal processing, and signal integrity. The successful candidate will play a crucial role in developing IO performance models for chiplet-based high-speed communication protocols and generating complete high-speed link performance matrices based on advanced packaging.

Key Responsibilities:

• Develop IO performance models (Tx, Rx) for chiplet-based high-speed communication protocols such as UCIe, AIB, and others.
• Create complete high-speed link models by integrating IO performance models with advanced packaging interconnects.
• Generate comprehensive high-speed link performance matrices, considering various parameters such as technology node, area, latency, power, number of channels, micro bump pitch, and frequency of data rates.
• Collaborate with cross-functional teams to ensure the successful integration of IO performance models into the overall system design.
• Develop parameterised PDN model and fluent in analysing SI and PI simulations
• Stay up-to-date with the latest advancements in high-speed IO modelling techniques and technologies, and apply this knowledge to improve existing models and develop new ones.

Required Qualifications:

• Master's degree in Electrical or Computer Engineering with 2+ years of relevant experience, or a PhD in Electrical or Computer Engineering with 1+ years of relevant experience.
• Strong understanding of package/interconnect/I-O modelling, statistical analysis, jitter analysis, digital signal processing, and signal integrity.
• Experience in mixed-signal circuit design for High-Speed IOs (e.g AIB, AXI, UCIe).
• Proficiency in IBIS-AMI specification and model creation using Keysight ADS.
• Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications:

• Ability to develop and implementing high-speed IO performance models using industry-standard tools/methodologies.
• Experience with advanced packaging technologies and their impact on high-speed link performance.
• Strong problem-solving skills and the ability to think creatively to overcome technical challenges.
• Excellent communication and collaboration skills, with the ability to work effectively in a team environment.

About us:

Data science is an important component of biomedical and translational research, where data of multiple modalities are being constantly generated at unprecedented scale. The Research Data Integration group in the Biomedical Datahub Division of the Bioinformatics Institute (BII), A*STAR, aims to bridge the complexity of computational biology and data science with the needs of biologists and clinicians to drive biological discoveries and predict translational outcomes. One of our immediate challenges is to analyze and integrate and analyze multi-omics, imaging and clinical data generated by biomedical institutes in A*STAR, healthcare institutions and national initiatives in Singapore to improve the usability and interpretability of large-scale multimodal datasets of cancer, metabolic diseases, and other diseases. We seek motivated individuals to join us to push the potential of biomedical data in truly benefitting patients.

Job description:

We are developing data platforms in BII Biomed DAR, integrating healthcare data including clinical and research data, for various diseases including cancer, metabolic diseases and skin diseases. We are seeking a computational scientist to develop analytical, statistical and machine learning methodologies and workflows for analysis and integration of large-scale multi-dimensional omics (bulk, single-cell, spatial), perturbation screens, imaging and clinical data) for these data platforms. The candidate is expected to drive data science research to uncover underlying diseases biology, druggable targets and develop personalized medicine approaches. This position offers the candidate an opportunity to work closely with a team of clinicians, wet-lab scientists and computational biologists. He/She is also expected to drive high impact publications and manage large-scale projects, include data management.

Requirements:

• PhD in Bioinformatics, Computational Biology, Data Science, Computer Science, Mathematics, Engineering or a related field with at least 5 years of relevant experience.
• Proficient programming skills (e.g. Python, R, RStudio, Jupyter Notebook, Shinyapps).
• Familiarity with Unix/Linux environment and cloud architecture (AWS).
• Experience in large-scale omics (bulk, single-cell, spatial) data analysis and/or AI/ML.
• A background in life sciences, biology or biomedical informatics is preferred.
• Knowledge in data standards and interoperability.
• Strong analytical and problem-solving skills.
• Excellent oral and written communication and presentation skills.
• Able to work independently, and as part of a team, with a positive and enthusiastic learning attitude.
• Competent project and data management and organizational skills will be very valuable.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

JOB DESCRIPTION

This job focuses on software development for Software as a Medical Devices. Junior Project Manager will be working closely with Project Managers and project teams to ensure the software as a medical device product management Lifecyle is followed thoroughly.

• Support project manager in Plan and execute Software as a Medical Device (SaMD) projects including AI applied to healthcare.
• Support technical team in product development, design verification and validation of medical devices including software as medical device.
• Prepare design and development documentation by working together with software developers, quality and regulatory personal.
• Prepare project agreements, procurement specifications and Technical documents.
• Follow-up on project milestones.

REQUIREMENT

• Preferred to have one year of experience in software development or medical device product development.
• Educational background of computer engineering or bio medical engineering
• Knowledge in software development, experience in software development environment will be an added advantage
• Knowledge / willingness to learn the ISO 13485 documentation practices and drive project teams for adherence
• Ability to follow up on commitments

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

JOB DESCRIPTION

This job focuses on software development for Software as a Medical Devices. Junior Project Manager will be working closely with Project Managers and project teams to ensure the software as a medical device product management Lifecyle is followed thoroughly.

• Support project manager in Plan and execute Software as a Medical Device (SaMD) projects including AI applied to healthcare.
• Support technical team in product development, design verification and validation of medical devices including software as medical device.
• Prepare design and development documentation by working together with software developers, quality and regulatory personal.
• Prepare project agreements, procurement specifications and Technical documents.
• Follow-up on project milestones.

REQUIREMENT

• Preferred to have one year of experience in software development or medical device product development.
• Educational background of computer engineering or bio medical engineering
• Knowledge in software development, experience in software development environment will be an added advantage
• Knowledge / willingness to learn the ISO 13485 documentation practices and drive project teams for adherence
• Ability to follow up on commitments

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

MedTech Catapult is a national initiative for accelerating the development of high-value MedTech projects through an in-house product engineering unit. This productization unit is responsible for supporting the development of technologies through the medical device development cycle to produce full-fledged hardware product systems.

The Lead Engineer will report to the Lead, Product Engineering.

Job Responsibilities

• Responsible for software engineering efforts for integrated medical technology product solutions.
• Responsible for software architecture design and FW requirements specifications generation.
• Design, develop and implement embedded SW for medical instruments and devices and related interface systems using a variety of languages (e.g. C#, ASP.NET etc.), ensuring optimal performance, reliability, and power efficiency.
• Lead software risk management and DFMEA, software verification and validation activities from early concept phase through release to manufacturing according to IEC 62304.
• Responsible for software integration and implementation for embedded systems, ensuring products are according to design requirement.
• Write and execute complete testing plans, protocols, and documentation.
• Identify, debug, and create solutions for issues with code and integration into application architecture.
• Incorporate real-time data acquisition from sensors and closed loop control algorithms and verify real-time closed loop control of systems parameters.
• Support development of intellectual property portfolio in device design and process technology know-how.
• To interact closely with engineers from other disciplines to achieve an optimized design within the stipulated project schedule.
• Write and review documentations for QMS.
• To support other activities for product engineering when required.

Requirements

• Degree in Information Technology, Computer Science, Electronics or a related discipline.
• Minimum 10 years of experience in developing embedded firmware with hardware integration experience related to MedTech applications.
• Complete product lifecycle experience including early concept work, and successful transfer of designs into manufacturing.
• Experience with electrical components such as ADC, DAC, stepper and dc motors, image sensors, Ethernet, I2C, SPI, USB and CAN.
• Good experience with ARM processors or other microprocessor architectures.
• Knowledge of computer architecture and operating systems.
• Familiarity with variety of Operating systems including Windows, MacOS X and Linux; and Mobile platforms, including iOS and Android.
• Familiarity with Network technologies, including TCP/IP, Bluetooth, Zigbee, WiFi and Modbus.
• Familiarity with Languages such as C/C++, C#, Python, MATLAB, and Java.
• Experience managing QMS and proficient with GMP guidelines.
• Good collaboration skills, organised and detailed.
• Demonstrate strong interpersonal skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Job Description

• Working closely with Finance and assist in billing of customers.
• Follow up with customers on overdue invoices.
• Communicate with customers/vendors via phone, email or personally and investigate and resolve customer queries.
• Performance of Good Receipt.
• Maintain and update booking system details when needed.
• Collation of information for Management.
• Assist with Management / Financial reporting.
• Preparation of presentation slides.
• Carry out other duties and tasks that may be assigned from time to time.

Job Requirements:

• Diploma in any discipline (preferably in Business, or accountancy related).
• Proficient in Microsoft Office (e.g. Outlook, Word, Excel, Powerpoint)
• Excellent interpersonal and communication skills, meticulous.
• Good spoken & written communication skills.
• Able to work independently and multitask.
• Knowledge of SAP system will be advantageous

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Job Description:

• Be a member of the leadership team to achieve the vision and mission of the National GaN Technology Centre (NGTC).
• Lead the Technology, Engineering and Industry team in technology road mapping and R&D pathfinding in device architecture, fabrication process technology, and MMIC design.
• Lead the Technology team, which comprises (a) characterization & modelling, (b) MMIC design, testing & model validation, (c) device failure and reliability analysis, (d) ultra high frequency GaN-on-SiC device design, layout, fabrication and characterization, and (e) low voltage GaN-on-Silicon device design, layout, fabrication and characterization.
• Coordinate with the Engineering team to develop ultra high frequency devices, ultra low voltage devices, and their MMICs.
• Coordinate with the Engineering and Operations teams to ensure timely delivery of the projects.
• Initiate and secure research grants and industry funding.
• Initiate, coordinate and manage research collaborations with IHLs and industry partners.
• Provide regular progress report of the Technology team’s activities to NGTC management.
• Represent NGTC in customer meetings.

Requirements:

• PhD in Electrical & Electronic Engineering, Materials Science and Engineering, Microelectronics Engineering, or closely related fields are welcome to apply.
• Deep understanding of GaN-HEMT device physics and GaN-based MMICs.
• At least 12 years of post-PhD hands-on experience in GaN HEMT and MMIC technology development including design, characterization (e.g. DC, small-signal and load-pull measurement), and modelling; preferably in RF GaN-on-Silicon or GaN-on-SiC technologies.
• At least 12 years of experience in leading a team of research engineers/scientists in managing multiple projects.
• Candidates with industry experience in GaN related R&D would be preferred.
• Working knowledge and hands-on experience in Design of Experiments (DOE) methodologies, statistical root cause analysis, problem-solving methods, and in-line metrology techniques is desired.
• Possess strong leadership, project management, interpersonal and oral/written communication skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

ROLE:
IME is leading the effort to establish the industry leading Silicon Carbide R&D program. This program aims to advance 200mm Silicon Carbide technologies in various areas, such as epitaxy, device design, process integration & fabrication, and power module packaging. The main objective is to drive disruptive innovations in power device research, with a specific focus on >1.2KV power MOSFETs. These innovations are intended to enhance automotive technologies, vehicle electrification, safety measures, sustainable energy grids, and industrial automation. Key aspects to demonstrate for this role include high power device design, novel device concepts, doping design, gate oxidation, and wide-bandgap process simulations. To achieve this, we are seeking individual with extensive industry experience in using Synopsys/Silvaco TCAD simulator, relevant device characterization skills, design simulation development abilities, a willingness to mentor junior staffs, and strong interpersonal skills. The candidate will contribute to the wide-bandgap & Silicon Carbide team by utilizing their device knowledge, guiding team on device characterization, implementing state-of-art Silicon Carbide power MOSFETs (Planar, Trench & Super-Junction), and innovative novel power MOSFETs for future applications.

RESPONSIBILITIES:

• TCAD modeling & simulation, novel high power device design, simulation, and device characterization

• Design and simulate high voltage Silicon Carbide MOSFETs (planar, trench, SJ MOSFET, IGBT) with a blocking voltage of >1.2K using Synopsys/Silvaco simulator

• Design & simulate practical and effective junction terminations

• Provide guidances on device structure, optimizing cell, power/performance analysis, process risk assessment, and recommendations for experimental split and improvement

• Develop and apply fundamental MOS device physics-based TCAD modelling & electric field management to calculate band structure, carrier transport, blocking voltage,
switching properties, and thermal management for vertical power devices in the presence of interface state density, gate oxide defects, and defects in Silicon Carbide

• Model transport and carrier scattering in devices operating in extreme ambient conditions

• Collaborate with diverse teams, including process integration, characterization, and circuit design engineers, to analyze and troubleshoot device-related issues during
development

• Serve as a resource for colleagues with less experience, and lead small projects with manageable risks and resource requirements

• Work closely with both internal and external customers to understand customer issues and align their demands. And grow this wide-bandgap team to ~5 headcounts in the
next 3 years.

JOB REQUIREMENTS:

• PhD in Electrical Engineering or related field

• >10 years industrial experience for high power device design and modeling

• Deep knowledge of high voltage, high power MOSFETs (including Planar, Trench, S-J MOSFETs, and IGBTs) design and device characterization on 4H-SiC & GaN substrates.

• Solid understanding of wide-bandgap semiconductor materials and the strong physics of MOSFET devices

• Ability to teach and transfer knowledge to junior staff members

• Ability to effectively communicate and plan with customers regarding their needs, issues, and demands

ROLE:
A*STAR-IME is leading the way in establishing industry first 200mm open Silicon Carbide (SiC) R&D program. The program specific focus is on advancing 200mm SiC technologies in key areas such as epitaxy, gate stack, ion implantation, and dry etching, and integrating these modules to fabricate high-performance power devices. Our objective is to drive innovation in power device research, particularly in power MOSFETs rated above 1.2KV. Developing key innovative process is crucial for creating high-performance devices that will contribute to advancements in automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. This role involve growing leadership into ion implantation processes for p-body, channel, guard ring, source contact, and other components. We are currently seeking such individual with ~5 years of experience in ion implantation. The chosen candidate will be responsible for independently supervising ion implantation processes, conducting ion implant simulations, possessing knowledge of crystallography and ion interaction with atoms, having strong understanding of implanters and related thermal processing physics, beam optics, dosimetry systems, and vacuum technology. The ideal candidate should also be willing to collaborate with various departments, the technology development group, and customers. Furthermore, the candidate will contribute to the wide-bandgap team by sharing the ion implantation expertise on compound semiconductor materials and collaborate with other departments working with Si-based technology. The candidate will also be groomed to lead this diffusion process module group of ~6 headcounts into the future.

RESPONSIBILITIES:

• Diagnose malfunctions and using test equipment & software to test faulty tool; applying knowledge of the functional operation of the ion implant equipment

• Support on-site ion implanters in creating, running & characterizing recipes for recipe validation and develop process to achieve the desired dopant profile with excellent
damage recovery.

• Collaborate with vendors to optimize equipment performance and reduce tool downtime

• Analyze data related to implant-related defects formation with quantification and defects minimizations strategy

• Examine work-orders and communicates with equipment operators to resolve equipment problems & determine mechanical and human errors contributed to the issues

• Perform scheduled preventive maintenance tasks with tool operators, especially in checking, cleaning, repairing, detecting and preventing problems

• Responsible for designing experiments for ion implantation at various dose, energy, tilt, and twist levels

REQUIREMENTS:

• Ms/PhD Degree in Electrical Engineering or related field

• >3-5 years industrial experience for high power device design and modeling

• Extensive proficiency in medium to high energy/current ion implantation processes, including a comprehensive knowledge of implant equipment, equipment parts, and
troubleshooting techniques to minimize equipment downtime

• Good understanding of wide bandgap semiconductor materials and their corresponding dopant species

• Expertise in ion channeling, ion bombardment, and their impact on the implant species profile

• In-depth comprehension of defect formation and annihilation processes in the implanted region of semiconductors

• Familiarity with essential device properties resulting from ion implantation

• Adept at mentoring and transferring knowledge to junior staff members

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

Job Description:

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty technologies at IME. His or her main roles and responsibilities include:

• Develop and support Chemical Mechanical Planarization (CMP) unit process capabilities for silicon photonics, flat optics, advanced packaging, MEMS, and wide bandgap semiconductor applications.
• Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of CMP.
• Participate as team member with process integration teams to actively support CMP process development, optimization and troubleshooting for various industry and grant projects.
• File patents/know-hows on new development activities.
• Publish research findings in prestigious journals and conferences.

Job Requirement:

• Masters with specialization in Electronics / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• Minimum 5 years of experience in CMP technologies, preferably in an industrial setting.
• Prior hands-on experience working on industry-scale 200 mm or 300 mm CMP equipment platforms (e.g., AMAT or Ebara platforms), with in-depth technical knowledge in process development, materials, and inline process control related to CMP.
• Knowledge of silicon photonics, advanced packaging, MEMS, or wide bandgap semiconductor technology platforms would be a plus, but not mandatory.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal and strong demonstrated skills in collaborating with internal and external stakeholders.
• At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred
• Good analytical skills and oral/written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of CMP technologies and industry trends.

As an Equipment Engineer, you will own all assigned toolsets. The preferred candidate can troubleshoot difficult and poorly defined problems related to mechanics, electronics, and processes using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will collaborate extensively with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Responsibilities:

• Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Main Stream Semiconductor Processes and Advanced Packaging processes. Highly desirable for a candidate to have a background in at least one of the following areas: Photolithography, PVD and CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology (some areas may be combined).
• Work with process engineering to drive root-cause corrective actions for equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
• Lead continuous improvement teams to drive tool matching, availability, and throughput improvements and reduce risk.
• Management of new tool installation, start-up, and tool upgrades to increase fab capability and capacity, lower costs, and improve yields.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
• Participate in cross-functional teams that create efficiencies across all layers of the organization.

Required Qualifications

• Degree / Diploma with 10+ years of relevant Semiconductor Industry Experience in Mechanical, Electrical, or Chemical Engineering, Materials Science, Physics, or another relevant Engineering discipline.
• 6+ years of experience within the respective areas of expertise. Experience should include one or more: Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, and Wet Chemistry.
• Demonstrated experience with the application of structured problem-solving methodology.
• Positive interpersonal skills, highly energetic and self-motivated.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.

Preferred Qualifications

• Diploma or Bachelor of Science/Engineering in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.
• Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, Wet Chemistry.
• Positive interpersonal skills, highly energetic and self-motivated.
• Experience with Automated Fault Detection and Classification Systems (FDC).
• Strong background with utilizing SPC.
• High level of understanding of equipment component behaviour.
• Experience Integrating Equipment Maintenance Management Software

Job Description:

Be part of an exciting Team working on cutting-edge advanced packaging process technologies. Partner and work with various FAB users, to always enable smooth operations and develop packaging solutions and taking the solutions from concept to production. Responsibilities will also include assisting in operations support in FAB clean rooms to make sure all rounded supports are provided.

This position is based in Singapore.

Responsibilities:

• Looking for a reliable, agile, and professional individual.
• Oversee the Team spare/ chemicals / inventories stores – upkeep with good house-keepings, periodic cycle counts. Maintain the inventory database, ensuring timely and accurate recordings, raise purchase requests accordingly.
• Take charge and provide day to day supports in all logistics needs and initiate material/spare parts procurement when required to ensure smooth Fab operations.
• Accountable for the inventory movements required to enable smooth lot operations across IME Premises.
• Follow through the orders from the start of purchase till delivery and to ensure that goods are delivered are on time.
• Work seamlessly with various stakeholders to provide logistics support and deliver inventory on time.
• Work towards and employ critical thinking, put-up good initiatives to move forward to digitalization.
• Ability to work in a multi-task environment.

Experience:

• Education: Diploma in engineering discipline. Preferably in supply chain logistic/ warehouse operations.
• At least 2 years of warehouse operations.
• Preferably some experience in semiconductor / manufacturing environment, with good wide contacts with semiconductor material suppliers, equipment vendors.
• Strong knowledge-based on excel skills and some knowledge of supply chain analytics.

ROLE:

IME A*Star is currently working on establishing a hybrid fabrication platform for 150mm & 200mm Silicon Carbide (SiC) power MOSFETs as part of the new SiC R&D program. The main objective of this program is to advance 200mm SiC technologies in various areas, such as epitaxy, device design, process integration for various types of power MOSFETs and power module packaging. The ultimate aim is to drive disruptive innovations in power device research, with a specific focus on >1.7KV power MOSFETs. These innovations will have significant applications in enhancing automotive technologies, vehicle electrification, safety measures, sustainable energy grids, data centers, and industrial & aerospace automation. Key aspects for this deputy lead for wide-bandgap device integration role include the development and integration of several modules, such as gate oxidation, implantation, implant activation, layout design verification, lithography, ohmic contact formation etc are essential. We are actively looking for individual with extensive industry experience in device physics and process integration to join our team. The candidate will contribute to process integration, device layout design, design verification, E-test and module process related data analysis, yield enhancement, and device physics.

RESPONSIBILITIES:

• To lead development of SiC power technologies, serving as both front and back-end process integration in collaboration with advanced module development team. And aim
to grow this team to ~10 headcounts in the next 3 years.

• Optimize and customize process flows for individual SiC products

• Identify and resolve process integration issues and related problems

• Develop specific or derivative processes to meet customer needs

• Support new designs by conducting module characterization and developing effective design rules

• Define and implement measures to enhance stability, yield, reliability, and reduce development costs & time

• Plan and implement sustainable corrective actions to address process deviations

• Continuously monitor and utilize expertise in process and equipment capabilities to achieve optimal device performance

• Determine the correct and effective way to deliver processes, functional devices, and other items to multiple customers

• Perform project management tasks and conduct data analysis

REQUIREMENTS:

• MS/PhD Degree in Electrical Engineering or related field

• >3 years industrial experience for MOSFET process integration and device Physics

• Highly proactive, self-motivated, and results-oriented professional with the ability to make efficient contributions to and lead technical discussions

• Extensive expertise in material and process integration

• Comprehensive understanding of semiconductor materials and MOSFET device physics

• Proficient in teaching and knowledge transfer to junior staff members

• Strong communication skills to effectively convey information about process module integration for device fabrication and with customers

• Excellent analytical skills for interpreting process and device data; combined with strong presentation abilities.