Total 69 job vacancies by Micron Semiconductor Asia Operations Pte. Ltd.

This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE, you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (Front End) and electrical test (Back End) data and respond to failures. In this role, you will work with various Technology Development (TD) & New Product Introduction (NPI) Engineering (Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Assembly) and Manufacturing groups to find the root causes of the failed units.

Responsibilities and Tasks

• Enable new test signals in BE which would capture assembly related failures.
• Work with Test Solution Engineering (TSE) & Product Engineering (PE) to ensure standardize test coverages & chars. Define Char limits, and approval of any test related changes.
• Development of new out-of-control-action-plan (OCAP) and its sustenance
• Provide Lot disposition based on parametric data observation in case of out-of-control (OOC) trigger.
• Ensure that Silicon & assembly process meets Product expectations by extracting and analyzing Probe and BE test data.
• Participate in Phase Gate review meetings, presenting the data analysis and deciding on Phase Gate exits related to electrical Test data.
• Analyze test failures, coordinating EFA & PFA to identify the root cause. Implement fixes for fails (Fab process or Design or Assembly Process)
• Finding out the correlation of test failures to assembly process and updating the database with the signatures observed
• Support Global and Local material review board (MRB) in case of excursions and RMA related to package intrinsic design. This includes analyzing electrical test data for root cause analysis (RCA) and assessing the health of the contained material.

Requirements

• Bachelors/ Masters in Electronics, Device Physics, Applied Physics, Electrical
• Sound knowledge of device physics
• Knowledge in Engineering Statistics
• Experience in data (electrical) analysis and modelling (JMP, Spotfire is a plus)
• Experience in programming (Python or Perl)
• Effective communication skills in written and spoken English
• Good multitasking and organizational skills, able to make decisions in complex situations
• Excellent problem solving and analytical skills
• Experience in NAND / DRAM memory or related field
• Knowledge in semiconductor packaging assembly processes
• Experience in fabrication processes, electrical characterization techniques, metrology techniques

As a Senior Package Design Engineering (PDE) Central Engineering System and Analytics (CESA) Engineer, you will develop integrated solutions to empower Backend Operations to make data-driven and heuristics-based decisions. You will work across Global Operations and sites to improve Cost, Scale, Quality, and Cycle Time by defining and designing data architecture and collaborating with key partners.

Responsibilities

• Yield Enhancement (YE) lots analysisLead YE lot analysis including reconstructing fuse identififaction (FID) for traceability, statistic comparison for different group
  
• Yield modelling / pareto benchmarkingIdentify actionable opportunities from YE lots
  Develop and improve Yield Models for HBM
  Periodically improve models based on actual performance
  
• Best Known Methods (BKM) DeploymentDevelop BKM’s for YE and drive implementation
  Identify/align BKMs and monitor implementation
  Works with different teams in the identification of critical metrics

Requirements:

• PhD/Masters/Bachelors in Statistics, Mathematics, or a related field; advanced degree preferred.
• Minimum of 3 years of experience in semiconductor manufacturing or related fields
• Preferably with experienced in Package Design Engineering and Yield Enhancement
• Strong understanding and knowledge of semiconductor manufacturing processes and technologies.
• Proficiency in statistical/machine learning and statistical techniques skills will be additional advantageous;
• Experience in MRDA will be a plus
• Proven ability to make decisions, multi-task, and solve problems and address root causes.
• Exhibit critical thinking to see opportunities.
• Effective communication skills in verbal/written.
• Self-motivated. Able to work independently with minimal supervision.
• Able to travel as required to support department and company objectives.

As a PDE Central Process Integration Principal Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide synergy

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

JOB QUALIFICATIONS

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

As a PDE Central Process Integration (PI) Senior Engineer, you will lead the development and integration of assembly and packaging processes for cutting-edge semiconductor products, such as DRAM, NAND, controllers, graphics, 3D-stacked (3DS) technologies, and High Bandwidth Memory (HBM). The ideal candidate will drive innovation in packaging technology and ensure seamless process integration during new product introductions.

This position involves working closely with multi-functional teams to research, design, and implement new packaging solutions while optimizing production yields and ensuring the successful commercialization of next-generation semiconductor technologies.

JOB RESPONSIBILITIES

Promote worldwide alignment

• Improve benchmark performance and efficiency gains through global project management and execution
• Network BKM leveraging and enhancement, business process creation and re-engineering
• Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Sites, TD, Product Engineering, Global Quality
• Help drive and fix the issue where necessary

Drive FE-AT Integration initiatives

• Business process governance between Fab – Assembly (WSPEC, FE2BE forum, WPSWAT)
• Lead & drive FE-AT excursions
• Yield, DPM related issues that involves both Fab – Assembly

Cross sites benchmark & achieve BIC yield performance

• Lead PI programs, PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow

Identify, Propose & Drive new initiatives programs

• Propose & lead strategic programs to shift left/ shorten cycle learning across TN phase (PD, NPI, HVM)
• Process flow simplifications & standardizations
• Cross technology streamline (Process, tools, etc)
• Sites expansions process & qualification requirements
• Drive roadmaps with multi-functional teams (FE, AT Procurement, APTD, APPDE)

Requirements

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• 3+ years of experience in semiconductor packaging technology development, process integration, or new product introduction (NPI)
• Strong background in frontend fabrication processes (FAB)
• Proven experience in data analysis, statistical process control (SPC), and process optimization.
• Strong problem-solving skills, attention to detail, and a proactive approach to technology development.
• Excellent communication and teamwork skills, with the ability to work across departments and with external partners.
• Hands-on experience in the development and implementation of cutting-edge semiconductor packaging technologies.
• Experience leading multi-functional teams in process development, technology transfer, and ramp-up.
• In-depth knowledge of the latest industry standards and trends in semiconductor packaging and assembly.

Keen on the role? Apply now!

As an Accelerated Technology Package Development Engineering (ATPDE) Strategic Program Manager, you'll drive ATPDE's Engineering Strategy Programs in collaboration with Technical Experts and Senior Leaders within ATPDE, PDE, Global Assembly & Test, and Global Quality. This role demands strong project management, proficiency in MS suite, data analytics, dashboard/report creation, excellent English communication skills, people engagement, tenacity, resourcefulness and strategic vision to support Micron’s key initiatives.

Key Responsibilities

Lead strategic engineering initiatives by creating plans, setting achievements, and prioritizing tasks while maintaining consistent communication with partners. Predict risks and challenges, manage program prioritization and timelines, and balance business requirements against technical and operational limitations. Additionally, you must establish both quantitative and qualitative metrics to assess the effectiveness and efficiency of key programs, implement systems and processes, and oversee and drive programs to successful completion:

• Drive Accelerated Technology for PDE (ATPDE) Global network management to develop & implement strategic, process development, technode development and quality engineering programs that are aligned with PDE and Micron’s quality strategic objectives
• Structure and implement analysis to develop recommendations and drive execution / implementation in a fast-paced, data-driven environment.
• Identify continuous improvement opportunities in business process and cross-functional/regional quality functions
• Engage various partners from technical experts to senior leadership to facilitate and drive key strategic & quality engineering programs for ATPDE, PDE & global Assembly & Test network.
• Being able to apply project management skills to initiate, plan, implement, drive, and evaluate the project effectiveness
• Must have a strong data analytic skill, coding & script (phyton), dashboard (Power BI/ Tableau etc.) design and development skills
• Publish on-time weekly business reports.

Requirements

• Bachelors in any Engineering or Science (Data Analysis/Statistics) or related
• Experiences in Technology/IT project management
• Experiences in high technology or semiconductor industry
• Experiences working across time zones in multi-functional global teams
• Proficiency in data analysis, dashboard design and development (Power BI/Tableau, etc.), project management, and English communication
• Knowledge and experience in automation, product, or process engineering is advantageous.
• Strong project management skills
• Strong analytical skills and effective problem solvers, with ability to navigate ambiguity
• Excellent communicator, with the ability to manage and influence partners at all levels
• Strong sense of ownership and ability to work across different functions and Business Units
• High learning agility to quickly understand the value drivers in numerous and diverse types of strategic/ engineering programs/ projects
• Strategic partner engagement capabilities, including clear understanding of partners’ needs, problem statement, and value proposition discovery, various types of business/ engineering analysis (good-to-have)
• Someone who is excited about how their contribution, their value to the organization, can support to transform how the world uses information to enrich life for all with Micron’s memory and storage solutions
• Keen on semiconductor industry

Keen on the role? Apply now!

As a Quality & Reliability Assurance Engineer in Global Quality, we are encouraged to conduct electrical failure analysis and data analysis of next-generation 3D NAND memory devices. To sustain and improve Micron's memory quality, and developing outgoing monitor strategies together with risk assessment and product disposition in deviation management in HVM (high volume manufacturing( environment.

Responsibilities and Tasks

• Develop outgoing quality and reliability monitor strategies of NAND products in production phase.
• Perform product failure analysis on rejects to identify the failure mode and mechanisms that will lead to successful corrective actions and/or preventive actions.
• Assist and consult on post qualification quality and reliability issues and assist in the analysis and disposition of these materials.
• Coordinate with Research and Development and Product Engineering teams to comprehend new reliability issues and how to test for and assess their impact to customer risk and reliability.

Requirements

• Excellent problem-solving and analytical skills with strong attention to details.
• Ability to communicate clearly and concisely both verbally and in writing is essential in this role.
• Good organization skills and ability to multitask and coordinate between multiple issue at any given time.
• Ability to work optimally in cross-functional teams and handle pressure situations in a professional manner.
• Candidates with at least 2 years of experience in the semiconductor industry as QRA or Product Engineer are preferred but fresh graduates are welcomed to apply. Experience in flash memory debugging and failure analysis is a plus.
• Bachelor's or Master's degree Electrical Engineering, Electronics Engineering, or a related discipline.

Micron Packaging R&D group is looking for highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages.

Job Responsibilities

• Provide leadership in wire bond technology, problem analysis and resolution
• Develop and Transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages
• Process Development & Characterization, Qualification, and production pilot run
• Work with multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solution for products requirements
• Define, plan and implement technology roadmap to meet wire bond packaging roadmaps
• Qualify and transfer packaging technology to production site
• Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs
• Showcase and build organization reputation by publishing technical papers and submit invention disclosures.

Job Requirements

• PhD/Masters’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering
• At least 5 years of experience in semiconductor wire bond engineering
• Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem solving tools
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with global multi-functional teams

Keen on the role? Apply with us now!

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.

As a Manufacturing Engineer at MSB, you will be responsible for executing area resource plans in terms of logistics and indirect piece parts and managing, developing employee performance.

In this role some of the tasks that need to carried out include exploring continuous improvements activities to assist area management in running the production in a cost efficient and effective manner. You will need to forecast unplanned or ad-hoc staffing and training needs, monitor area performance and provide performance feedback, mentoring, and career development where appropriate.

Other responsibilities include ensuring a safe work environment by performing regular work area inspections and conducting timely event investigations. You will be working with various engineering and manufacturing groups throughout the company.

Requirements

• Bachelors / Masters in Mechanical Engineering, Mechatronics Engineering, Electrical and Electronics Engineering, Materials Engineering, Industrial & Systems Engineering, Chemical Engineering or related field.
• Has leadership experience and potential
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations
• Background in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals will be beneficial

Keen for the role? Apply now!

Develops, implements and maintains methods, operation sequence and processes in the manufacture or fabrication of parts, components, sub assemblies and final assemblies. Interfaces with design engineering in coordinating the release of new product. Estimates manufacturing cost, determines time standards, and makes recommendations for tooling and process requirements of new or existing product lines. Maintains records and reporting systems for coordination of manufacturing operations.

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area

- Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap

- Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements

- Work with equipment suppliers to develop new capability

- Engage in active participation in Package Development Engineering activities

- Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need

- Create decision matrix for equipment and material selection

Installation and qualification of new equipment platform and handover to production group (pilot line setup)

- Plan/submit capital request to acquire new Equipment

- Create purchasing specification (Doc2) document

- Establish the new equipment qualification criteria and activities roadmap with respective functional - team

- Establish project handover requirements and procedures upon machine qualification

- Prepare documentation for handing over with respective site owner

- Conduct data gathering for low volume production

- Conduct training for Site representatives

- Feedback loop for Continuous Improvement after mass volume production

Maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

- Maintain and regularly update the TOR, with inputs from local or other assembly site

- Maintain general knowledge of process and material characteristics and translate to equipment design requirement

- Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

- Maintain knowledge of design constraints and weakness of existing platform

- Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:
- PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Minimum 2 years’ experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good teammate, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers’ requirement
- Strong project management skills to ensure execution to timelines

Job Description

As Engineer of MSB Lean Manufacturing, you will manage the implementation of Lean transformation methodologies and tools in Assembly, Test and SSD manufacturing at MSB. You will collaborate closely with site functional teams to identify, explore and implement lean methodologies and tools to drive improvements in throughput, labor productivity, yield, and cycle time performance.

Responsibilities:

• Lead the adoption and implementation of Lean methodologies and tools across Assembly, Test, and SSD manufacturing.
• Facilitate continuous improvement events across different functional teams (e.g., Kaizen, Value Stream Mapping (VSM), Projects, Workshops).
• Develop and sustain programs and systems to foster a Lean culture.
• Conduct labor productivity analyses (e.g., Touch-time, MMR, spaghetti charts) to enhance operator and technician efficiency and reduce operational errors.
• Oversee Utilization/ Overall Equipment Effectiveness (OEE) to identify key sources of losses and improvement opportunities.
• Collaborate with functional experts to identify areas for improvement through the application of Lean methodologies and tools.
• Propose Lean approaches and initiatives, including Kaizen and Continuous Improvement Projects.
• Act as the key integrator between central and site functional teams, developing, driving, and communicating progress on critical Lean improvement initiatives.
• Develop an overall view of critical initiatives and their impact on key performance indicators.
• Provide visibility on program status, including key achievements with clear ownership.
• Trigger interventions to ensure programs stay on track towards targets.
• Support regular reporting and meetings with senior leadership, including deep dives for weekly/monthly reports and ad-hoc senior management updates.

Requirements

• Bachelor’s /master’s in Industrial and system engineering, engineering management, Production & Operation Management, or related field.
• Strong project management, analytical skills and problem solving skills
• Possess good communication and interpersonal skills, with the ability to work effectively with multiple multi-functional teams.
• Knowledge of Semiconductor processes, engineering and/or manufacturing operations
• Background in Overall Equipment Effectiveness (OEE) and/or Lean manufacturing fundamentals will be beneficial

Keen on the role? Apply now!

As a Senior Engineer in PDE (Package Development & Engineering) at Micron, you will be responsible for the Advance Packaging success within your scope in Metro Real-time Defect Analysis (MRDA) and guided by functional objectives, in terms of process, equipment and materials definition, development and/or optimization. You will manage and optimize your area's performance to meet or beat defined metrics. You will apply extensive knowledge to carry out tactics and collaborate with internal and external partners to build and implement packaging technology roadmaps aligned to corporate strategic objectives. You will provide advice to senior management related to tactical decision for the function. You will interact with executives, major customers and/or site managers to provide consultation, influence decisions and identify and resolve critical issues.

Identify, select, and evaluate new process, equipment and/or technology to support current and future requirements for MRDA area

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection
• Generates and set-up ADC, set-up/improve recipes
• Set-up PMON, Sampling Plans, BKM, CIP Strategies & performance indicators

Installation and qualification of new equipment platform and handover to production group

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

Define, improve and/or maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

• Maintain and regularly update the TOR, with inputs from local or other assembly site
• Maintain general knowledge of process and material characteristics and translate to equipment design requirement
• Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

• Maintain knowledge of design constraints and weakness of existing platform
• Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:

• Bachelor's/ Master's/ PhD in Electrical Engineering, Materials Science, Chemical Engineering, or related field
• 4 or more years of experience with proven track record of technical leadership in semiconductor manufacturing, preferably in MRDA Process & Equipment Engineering. Experience in other Front End areas, in Post Wafer Fabrication & High Bandwidth Manufacturing technology is of greater advantage.
• Be able to comfortably work across organizational boundaries and geographies.
• Ability to effectively collaborate with multi-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.
• Demonstrated ability to drive and implement a wide range of global initiatives with global teams.
• Organized, meticulous, and strong focus on results.
• Demonstrated ability to inspire teamwork and to effectively lead others.
• Demonstrated track record in baseline performance improvement, business process creation, process simulation techniques, data interpretation skills and proficiency in statistical analysis/method.
• Excellent analytical skills and organizational competency
• With good oral and written English communication skill
• Hands on in recipe development for inspection and measurement workstation such as KLA, Rudolph, Nordson, CAMTEK preferred

Keen on the role? Apply now!

As Sr/Engineer for PDE Technology Development Process Integration, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for NAND, mNAND and DRAM, Controller in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip/package interaction, equipment capability and process technology in the industry and the ability to enable best technology for New Technode & Product Introduction with assembly packaging requirements. You will also be required to drive & collaborate with multi-functional teams to resolve assembly process related problems.

Key Responsibilities

Ensure smooth transition from new process development, 1st qualification success to small volume production launch

• Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule
• Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
• Lead/partner with cross function team/site, to ensure successful transfer to CEM for LVM.
• Qualify new process/technology/equipment/materials
  Implement PDE TD PMI (Product Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM

Identify path finding opportunities for continuous yield improvement and cost reduction activities

• To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
• Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

Provide new solutions on time to meet company and customer needs

• Define, develop and establish process capabilities, strategy and roadmap
  To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements:

• PhD/Masters/Bachelor’s in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• At least 2 years' experience in semiconductor industry
• Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology
• Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus
• Strong project management skills to ensure execution to timelines
• Strong communication and presentation skills
• Understanding of business needs and customers’ requirement
• Ability to integrate & partner with people from cross function teams

Keen on the role? Apply now!

As an Engineering Assistant in Technology Development Engineering Operation Management (TD Ops) in Package Development and Engineering at Micron Technology, Inc., you provide support to Technology Development operations of various TD & Pre-NPI related projects to make sure timely and satisfactory results are achieved that supports technology roadmap and commitments of PDE. Partnering with internal customers and internal/external partners to engage as a team and ensure a timely handover will be part of your critical tasks.

JOB DESCRIPTION:

Material/System Preparation & Management

• Coordinating workforce resources, procurement and delivery of materials.
• Timely secure project collaterals/materials according to project/requestor requirements. Eg, substrates, direct materials, indirect materials, etc.
• Optimize supply chain logistics, managing inventories and forecasts.
• Preparation of required systems before engineering build kick off.
• Process flow management, including create/update as required.

Engineering Build/Lot Management

• Work independently with internal and external teams to successfully manage TD builds.
• Coordinate all execution efforts in delivering engineering builds and TD operations per established standards and guidelines.
• Streamlines TD build schedules to meet program/project deadlines based on business priorities, avoid mis-handling or long staging time.
• Closely monitor/track TD build progress, call out issues as they arise for prompt resolution.

Operations Management

• Provide operational support to TD Ops Engineer, also covers external/ internal partners and internal customers.
• Ensuring that the organization successfully converts inputs (Eg, materials, labor, and technology) into outputs (Eg, qualification of technode, recipes, etc) in an efficient manner.
• Call out risk, issues and roadblock to teams/partners for immediate resolution.
• Identify improvement opportunities that improve TD and cross-teams’ efficiencies, optimizing the teams’ value and delivery. Through collaboration, generate high-quality, cost-effective solutions in compressed periods of time.
• Excel at building strong working relationships with partners across multiple programs/projects.

JOB REQUIREMENTS:

• Diploma in Electronics Engineering.
• 3+ years of experience in Semiconductor Backend Assembly Manufacturing or Operation Management.
• Good analytical and problem-solving skills.
• Exceptional collaboration skills, thriving in a team environment.
• With good oral and written English communication skill

Keen on the role? Apply now!

Supports engineering activities such as design, test, check-out, modification, fabrication, and assembly of prototype electro-mechanical systems, experimental design circuitry, or specialized test equipment. Applications may include analog, digital and/or video circuits and logic systems. Works from schematics, diagrams, written, and verbal descriptions, layouts or defined plans to perform testing, checkout, and trouble-shooting functions. Performs operational test and fault isolation on systems and equipment. Assists in determining methods or actions to remedy malfunctions. Assists in the design, construction, test, and check-out of test equipment. Uses manufacturing, test, development, or diagnostic equipment, including, but not limited to, test programs oscilloscopes, signal generators, and specialized test apparatus.

Micron is seeking a highly motivated and experienced individual contributor to join our Assembly Package Technology Development (TD) team. As a Sr/Engineer in the Process Development team, you will play a crucial role in developing and qualifying new materials, equipment, and wafer tech nodes for Micron's world-class products and devices.

• Primarily responsible for Cleanroom 1 (CR1) Area processes such as Wafer Grinding/ Stealth Dicing/ Laser Groove/ Die Separation/ and Wafer Saw. Cleanroom 2 (CR2) Flip Chip Underfill, Die Attach, and Wirebond
• Development and Qualification of new direct and indirect materials, new equipment, and new wafer tech nodes.
• Ensure product quality and process performance while driving projects focused on cost reduction, productivity improvement, risk mitigation, and resolving manufacturing challenges.
• Collaborate and lead teams from various departments to ensure smooth development transfer to all Micron network sites.
• Familiarize and implement PMI (Product Maturity Index) methodology and provide accurate documentation for product transfer.
• Develop, configure, and optimize Package Assembly processes (Front End, Bonding, and Back End) for Micron's memory products from pathfinding to NPI start-up and certification.
• Collaborate with Design teams globally in the development of assembly design rules, involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, and approving materials, process, and equipment changes in the CCB (change control board).

Requirements:

• Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics
• At least 5 years of experience in the semiconductor industry with proven knowledge and skills in assembly
• Excellent problem-solving skills and familiarity with data-driven analysis, statistical analysis, and data interpretation.
• Strong project management skills and ability to multitask to ensure the execution of timelines.
• Strong collaboration skills to work closely with diverse teams and gain insights into business needs and customers' requirements.
• Deep fundamental understanding of key risks in Cleanroom 1 processes and Cleanroom 2 process
• Multiple process capability is a plus

Roles & responsibilities can include but are not limited to:

Test Product Process of Record (POR) SME:

• Define the Business Process of Test Product Process and provide governance avenue.
• Facilitate & lead the discussion of POR, Manufacturing Build of Material (mBOM) in Review Board for alignment and endorsement prior to release and deploy in Master Data/Teamcenter.
• Provides expertise in Test / Product Process / Customer / Manufacturing BOM Attributes / Operation & Resources assignment, and support for the Work Package implementation.
• Support Teamcenter Manufacturing Change Request for BOP R&O, Work Package creation/change purposes.
• Well-manage and maintain a prioritized list of Topics, action items with timelines, owners, and due date that raised in Review Board.
• Collaborate with Manufacturing, Planning and various engineering team - Quality team, Process Integration team, Test Engineering, Product Engineering teams in Product Process Proliferation activities.
• Use ECN and GCP processes to implement and document changes.
• Understand and routinely use system capabilities to collect, investigate, and support accurate reporting, data analysis, and metric tracking.

Product Process and System Integration Buyoff:

• Govern and Support Test Product Process End-to-End UAT (User Acceptance Testing) for MES, BOP/BOI and host deployment in Backend from end-to-end Process & Operation needs by ensuring processes and procedures are properly tested, communicated, and deployed.
• Work with Engineering, Manufacturing, Quality, System IT, and other relevant teams to support MES (Manufacturing Execution System) and/or BOP (Bill of Process) / BOI (Bill of Information) systems used in Backend area.
• Leverage knowledge, experience, and skills with processes and systems to provide timely solutions for problems and business change requirements.
• Team with Business Analyst, IT and others functional team to minimize risk, improve area efficiency, and ensure product quality through proper system change control and validation.
• Occasional travel required.

Job Requirements:

• Bachelors in Electrical and Electronics Engineering/ Computer Engineering or related
• Experience in Data Visualization tools and libraries like Tableau, Power BI, and Python
• Proficiency with data analysis tools and manufacturing software support systems (MAM, SAP, etc.).
• Knowledge of Siemens Teamcenter Master data management and/or Critical Manufacturing MES systems and processes would be advantageous.
• General understanding of the backend operations for component assembly, component test operations.
• Has depth of understanding and ability to manage worldwide business process. Can take a business process approach in worldwide networks.
• Display leadership experience/potential. Has agility to lead and implement prioritized action items from both tactical and strategic point of views.
• Excellent verbal and written communication and presentation skills.
• Experience in SharePoint list management and in writing optimized SQL queries.
• Keen in semiconductor industry

Additional Job Description

Directs and coordinates engineering activities concerned with development, procurement, installation, and calibration of instruments, equipment and control devices. Determines conditions under which tests are to be conducted, and phases of test operations. Coordinates operational, functional and performance phases of tests. Analyzes and interprets test data. Prepares technical reports of for use by engineering personnel.